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Wednesday 8th July 2020
Device allows for controllable, directional emission of single photons to produce entangled states of pairs of quantum dots
Wednesday 8th July 2020
Source of thermodynamic instability found in 'rattling' behaviour
Wednesday 8th July 2020
Microelectronics and telecommunications players to jointly develop strategic roadmap of core technologies for future connectivity systems and components
Wednesday 8th July 2020
Researchers in Korea develop photonic wireless system from skin-attachable micro-LED patch and implanted photovoltaic device
Tuesday 7th July 2020
PowerCuSoft copper bonding ribbon enables SiC power modules to be designed and manufactured more reliably, efficiently and cost-effectively
Monday 6th July 2020
As announced earlier this month, optical component and materials maker II-VI has licensed Silicon Carbide (SiC) technology from General Electric with a view to move into power devices and modules. Just like Cree/Wolfspeed and Rohm Group Company (including SiCrystal), the main competitors of II-VI on the SiC wafer market, the new licensee aims to capitalise on the growing market demand for SiC-based power electronics, driven by the fast development of EV/HEV applications.
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Monday 6th July 2020
Researchers at the Fraunhofer-Institute for Applied Solid State Physics IAF have integrated their monolithically integrated GaN power ICs using PCB embedding technology as a half bridge circuit, including gate and DC link capacitors. The result is an extremely compact and efficient highly integrated voltage converter of the 600 volts class in a user-friendly package. The integrated functionality in the chip and all critical passive components on the package allow it to be used in a modular fashion, thus reducing the effort required for the development of future power electronic systems.
Monday 6th July 2020
Lynred, a global leader in designing and manufacturing high-quality infrared HgCdTe and InGaAs technologies for aerospace, defense and commercial markets, and IRT Nanoelec, a technology research institute for microelectronics, today announce that Lynred has joined the Nanoelec consortium as a partner.
Friday 3rd July 2020
Pfeiffer Vacuum has been shaping the vacuum industry since 1890
Friday 3rd July 2020
Professor Tao Wang and his team at The University of Sheffield have achieved record efficiency and a record spectral linewidth for the fabrication of ultra-small μLEDs.
Wednesday 1st July 2020
New IDTechEx report, “Materials Opportunities in Emerging Photovoltaics 2020-2040” predicts $38 billion dollars in 2040 without colliding with the silicon-in-glass “power station” business. There will be many opportunities for premium pricing of its new specialist materials.
Wednesday 1st July 2020
Company plans to scale capacity of 150 mm SiC materials while also scaling volume production of 200 mm materials technology to meet growing demand
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Wednesday 1st July 2020
Market energised by demand from hybrid & electric vehicles, power supplies and photovoltaic inverters
Wednesday 1st July 2020
Tuesday 30th June 2020
Apple’s launch of a new iPad Pro early next year will spur a wave of demand in the LED supply chain, says TrendForce
Tuesday 30th June 2020
Compact system can be equipped with UV LEDs to eliminate germs on critical surfaces such as mobile phones
Tuesday 30th June 2020
Companies sign agreement to manufacture optical engines based on POET˙s Optical Interposer platform
Monday 29th June 2020
Infineon adds another industry standard package to its CoolSiC MOSFET 1200V module family.
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Monday 29th June 2020
With the Class D audio amplifier market poised for massive growth, GaN Systems has set its sights on snaring a big chunk of the sector, reports Rebecca Pool.
Monday 29th June 2020
US government contract is for seven GaN-based AN/TPY-2 radars for protecting ground sites from incoming ballistic missiles
Monday 29th June 2020
OmniStar and ThermoStar gas analysers offer compact design and low detection limit
Friday 26th June 2020
UK government funding provided through UK Research and Innovation’s flagship Strength in Places Fund
Thursday 25th June 2020
Call for papers for online event on how new nano applications under research will lead to discoveries that have positive impact on the world
Thursday 25th June 2020
Using chemical dicing process, dramatic cost reduction can be achieved by substantial increase in die count per wafer

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