Satcoms start-up gets plaudits at Paris Space Week
Circuits Integrated Hellas (CIH), an Athens-based satcoms tech start-up, featured as a laureate startup in the Innovation Challenge at Paris Space Week 2025 (PSW), earlier this month.
CIH presented its flat panel antenna (FPA) chip solution to a group of the world’s top space industry contractors and investors. The company's proprietary approach combines III-V compound semiconductors with silicon in a 3D package, enabling lightweight, cost-efficient, and high-performance antenna systems tailored for Low Earth Orbit (LEO) satellite applications.
The design comes in a compact system-in-package (SiP) and antenna-in-package (AiP) configuration, housing both III-V antenna front ends and silicon circuitry. According to the company, its 3D chip stacking technology reduces antenna weight and size by 60 percent compared to traditional FPA chipsets, dramatically improving scalability and cost-effectiveness.
“Our selection for the Innovation Challenge underscores the value of our mission to reshape the future of satellite communications by making advanced, high-efficiency FPA chips accessible to the satcom industry,” said Paolo Fioravanti, CEO and co-founder of CIH.
This recognition follows CIH’s recent selection – from among more than 200 applicants – as one of the four winners of the ESA Partnership Initiative for Commercialisation (EPIC) European-Singaporean Space Start-up Competition.
The inaugural award recognises the most promising European space-related start-ups with strong relationships and opportunities in Singapore. Together with the other winners, CIH will participate in the Global Space Technology Convention & Exhibition 2025, scheduled for February 26-27, 2025, at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore.
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