Loading...
News Article

Peregrine Expands Patent Portfolio

News
On track to exceed 300 issued and pending patents by the end of 2016


RF SOI (silicon on insulator) firm Peregrine Semiconductor has announced the expansion of its intellectual property (IP) portfolio to over 280 issued and pending patents.

Since the Murata acquisition in December of 2014, Peregrine has increased its patent portfolio by 50 percent and is on track to exceed 300 issued and pending patents by the end of calendar year 2016.

With a company-wide focus on continuous invention, 70 percent of Peregrine's design and process engineers are directly involved in the patent process.

"Our patent team is committed to both the quantity and quality of our IP portfolio," says Dan Nobbe, vice president of corporate research & IP development at Peregrine Semiconductor.

"Peregrine has an over 25-year history of industry-leading innovation, and most of our patents have a large number of claims, which is indicative of the inventions' scope. We remain committed to pursuing many foundational patents based on our groundbreaking work in RF SOI. As our team continues to move the needle forward in RF and power management, Peregrine will continue to strengthen and protect its IP."

Peregrine's patent portfolio protects product and technology inventions for its two business units-mobile wireless solutions (MWS) and high performance analogue (HPA). 

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: