Disco installs first ultra compact water recycling unit
Japanese semiconductor equipment company Disco has announced the first installation at a customer's site of the DWR1710, an ultra-compact deionized water-recycling unit for dicing saws.
The DWR series can recycle wastewater from processing silicon wafers, compound semiconductors, ceramics, and glass wafers.
Since 2008, when Disco developed and installed the first DWR series, customers' needs for cutting water supply and waste water processing facilities have grown increasingly diverse, depending on the customer's existing facilities, capacity of the processing area, amount of deionized water needed for processing, necessity of water temperature adjustment, and installation costs.
The DWR1710 has a footprint of 0.31 m2, which is 57 percent smaller compared to the existing DWR1722. This has been achieved by trimming down the standard functions to only recycle deionized water, filtrate, and discharge floating substances. Some of the functions of existing units are available as optional functions.
It is most suitable for manual dicing saws with small water use. The cutting water pumping capacity is 10 L/min, supporting up to two or three Disco manual dicing saws.
A lightweight ion exchange resin unit with a high-performance ion-exchange resin encapsulated inside a specialized container can be used with DWR1710. The container is made of resin and can be treated as industrial waste. Conventional ion exchange resin units can also be used.
