SPTS Collaborates with Novati on New Plasma Dicing Line
SPTS, an Orbotech company and a supplier of wafer-processing solutions, has announced a collaboration with Novati Technologies, a nanotechnology development centre, to establish Novati's new plasma dicing line at its fab in Austin, Texas.
Novati has selected SPTS's Rapier-300S plasma dicing solution over competing options to provide next-generation plasma dicing capabilities and services for customers.
"Plasma dicing has many advantages over conventional singulation methods and offers designers and manufacturers greater flexibility with regards to die shape, size and position," stated Kevin Crofton, president of SPTS Technologies and corporate VP at Orbotech.
"The Rapier-300S is the latest addition to our Mosaic plasma dicing platform which includes wafer handling solutions for 150mm, 200mm and 300mm wafers, both full thickness and taped to dicing frames. Novati selected the Rapier-300S to provide their customers with the latest dicing technology to complement their advanced semiconductor fabrication solutions and services."
He added: "Novati provides customers with technology building blocks, engineering expertise, professional program management and a broad complement of flexible processing equipment that enable the accelerated development of 200mm and 300mm production-worthy solutions," stated John Behnke, president of Novati Technologies.
"In order to remain at the forefront of novel process development, we must provide our foundry customers with the latest process solutions capable of manufacturing next generation devices."
SPTS's Mosaic plasma dicing system with the Rapier-300S overcomes many of the design limitations of conventional dicing methods, particularly for smaller, thinner, more fragile die, as well as offering the potential for significant increases in yield and throughput.
Orbotech's yield enhancement and production solutions are used by manufacturers of LEDs, high speed RF on GaAs, power management devices, printed circuit boards, flat panel displays, advanced packaging, MEMS, and other electronic components.
