CNR-IMM Italy Uses Sentech Tool For High-k Material Research
Joint development agreement is exploring dielectrics and passivating layers on GaN and other wide band gap semiconductors.
The Institute for Microelectronics and Microsystems (CNR-IMM) in Catania, Italy is using a Sentech Instruments' plasma enhanced atomic layer deposition (PEALD) tool to investigate the integration of novel high-k gate dielectrics and passivating layers on devices based on GaN and other wide band gap semiconductors.
This is part of a joint development agreement between IMM and Sentech focused on developing and characterising laminated layers.
The use of alternative high-k materials helps shrink devices while keeping capacitance values constant and reducing leakage current density. Growing Al2O3-HfO2 laminated layers is among the most often used combinations for such applications.
"The Sentech SI PEALD LL reactor is a high performance and flexible system, allowing the production of several high quality dielectric thin films, whose physical properties can be tailored upon changing their chemical composition", says Raffaella Lo Nigro who is the scientist in charge of the PEALD tool and the collaboration with Sentech.
Lo Nigro has wide ranging expertise in the synthesis of binary and complex thin films by chemical vapour deposition methods for several microelectronic applications. "Possible applications of this activity" - continues Lo Nigro - "are related not only to the integration of novel gate dielectrics and passivating layers on wide band gap semiconductors, but also for RF devices based on graphene".
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE