IEEE PELS to offer GaN packaging webinar
On November 3rd, IEEE PELS will offer a webinar titled 'Getting the Most from GaN Transistor and IC Chip-scale Packaging' by Alex Lidow and Michael de Rooij of EPC.
GaN transistors and integrated circuits are significantly faster and smaller than their silicon ancestors. This has enabled many new applications such as envelope tracking, LiDAR, wireless energy transfer, and enhanced medical imaging. The webinar will cover the design and PCB manufacturing methods users need to maximise the speed and size advantages required for embracing the chip-scale package.
The presenters, Alex Lidow, EPC CEO and co-founder, and Michael de Rooij, VP of applications engineering, are both are widely published, including being co-authors of GaN Transistors for Efficient Power Conversion, the first textbook on the design and applications of GaN transistors
The one-hour webinar will be held from 11:00 AM to 12:00 PM (EDT).
