Loading...
News Article

II-VI Introduces 25 Gb/s Detector Chip Arrays

News
Now ramping up production of VCSEL and detector pairs for active optical cables in datacentres

II-VI Incorporated, a provider of solutions for optical networks, has announced the general availability of its 25 Gb/s detector chip arrays for active optical cables and transceivers deployed in datacentres.

The mainstream adoption of social media and cloud computing is fueling the growth of short-reach optical connectivity in datacentres. II-VI's 25 Gb/s detector chips enable 100 Gb/s short-reach transmission in active optical cables and transceivers. The high speed detectors feature large 40µm diameter apertures that greatly facilitate arrayed-receiver assembly manufacturing

"In this fast-growing market for intra-datacentre interconnects, customers rely on few merchant suppliers of optoelectronics with large scale manufacturing capabilities and a proven track record of reliability," said Karlheinz Gulden, general manager, II-VI Laser Enterprise.

"We improved our ability to quickly respond to our customers with several new state-of-the-art MOCVD reactors that we recently brought online to increase the manufacturing capacity at our facilities in Zurich, where we already have a long history of producing highly reliable pump lasers for terrestrial and submarine applications."

II-VI is now ramping up production of VCSEL and detector pairs. These chips are available in single-channel form or in 4-, 10- or 12-channel arrays. They are designed to operate at data rates of 10, 14 or 25 Gb/s to support Ethernet and Fibre Channel standards in datacentres and storage area networks.

II-VI at OFC 2017, Mar. 21-23, 2017

II-VI will showcase new products at OFC 2017 that are driven by advances in our materials and technology platforms. The product showcase will include novel embedded monitoring solutions for transport networks, highly compact optical amplifier solutions tailored to enable high bit-rate DWDM transceivers, as well as key devices and sub-assemblies for datacentre transceivers.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: