SPTS Technologies announces Chinese order
Wafer processing equipment firm SPTS Technologies, part of Orbotech, has won an order for its Mosaic plasma dicing system from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a Chinese packaging services provider.
Commenting on this recent order, Kevin Crofton, corporate VP at Orbotech and president of SPTS said: "JCAP selected Orbotech's SPTS plasma dicing solution over competing options because the Mosaic system demonstrated superior results and offers lower cost of ownership. We were also selected for our inclusive approach and willingness to work alongside other suppliers in the back-end space to produce sustainable process flows."
Crofton continued: "The Mosaic platform configured with the Rapier-300S is designed for handling 400mm framed wafers in a high volume manufacturing environment. It allows customers to offer industry-leading plasma dicing services that will meet the packaging needs of next generation devices. By adding plasma dicing to their service portfolio, customers can provide higher value packaging services and gain improved profitability in a highly cost sensitive industry."
According to Amandine Pizzagalli, Technology & Market Analyst, at Yole Développement and author of the report entitled "Thin Wafer Processing and Dicing Equipment Market", "Plasma dicing could reshape the dicing industry landscape by increasing the number of chips per wafer and thus reducing the cost of ownership of the dicing process. Driven by the rising demand for thinner wafers and stronger die, plasma dicing is positioned to become the only viable dicing option for next generation ultra small, ultra thin and fragile devices such as RFID, MEMS, and Power devices."
Crofton added, "We have had continuous interest in the Mosaic plasma dicing solutions in our demo lab, and we continue to win business and expand our installed base. We see this as a real validation of our dicing platform. System Plus Consulting's discovery of a plasma diced ASIC in the iPhone 7 Plus, which has been processed by our equipment, confirms industry acceptance and adoption of plasma dicing as a singulation method in the industry in high volume manufacturing."