Loading...
News Article

Nichia files Lawsuit against HTC in Germany

News
Patent infringement lawsuit targets LED in HTC U Ultra phone

Nichia Corporation has filed a patent infringement lawsuit in Germany at the District Court Duesseldorf against the Taiwan-based smartphone manufacturer HTC Corporation, and its affiliates HTC Europe and HTC Germany GmbH as well as Digital River Ireland, a global vendor that provides ecommerce and operates HTC's European web shop.

In the lawsuit, Nichia is seeking rendering accounts and damages, alleging that HTC's smartphone (product name: HTC U Ultra) equipped with white LED infringes Nichia's YAG patent EP 0 936 682 (DE 697 02 929).

Court finds in favour of Nichia against Everlight subsidiary

Meanwhile, Duesseldorf District Court has found with its judgment that WOFI - a Germany based manufacturer of residential lighting products - infringes Nichia's YAG patent EP 0 936 682 (DE 697 02 929) concerning white LED products.

WOFI is a subsidiary of Taiwanese LED manufacturer Everlight Electronics.The court rendered the judgment in favour of Nichia's claims for permanent injunction, also rendering of accounts and damages.

The court confirmed Nichia's claim for recall of the accused products from the commercial customers and destruction of the accused products being owned or in possession by WOFI. The judgment is not final and can be appealed. The court found in its judgment that the twelve accused white LED products of WOFI infringe claim 1 of the YAG patent.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: