Loading...
News Article

Veeco CNT ships 500th Atomic Layer Deposition system

News

North Carolina State University to use Fiji G2 ALD system in research on wide bandgap power devices, memory and sensors

Veeco CNT, formerly known as Ultratech/Cambridge Nanotech, has shipped its 500th Atomic Layer Deposition (ALD) system. The customer is North Carolina State University.

"The Veeco CNT Fiji G2 ALD system will be a critical tool to meet our ambitious research goals," said Bongmook Lee, research assistant professor of the NSF NERC ASSIST Center at North Carolina State University.

He added: "This ALD tool enables advances in our research for high performance CMOS, non-volatile memory, next-generation wide bandgap power devices, and environmental and physiological sensors.

"We selected the Veeco CNT Fiji G2 for its demonstrated ability to reliably deposit the most challenging oxide and nitride thin films. We are happy to be part of this milestone in receiving the 500th system and we continue to engage in a strong relationship with Veeco CNT."

The Veeco CNT Fiji G2 ALD System is a thin film next-generation ALD system capable of performing thermal and plasma-enhanced deposition in a modular, high-vacuum, flexible architecture that accommodates a wide range of deposition modes using multiple configurations of precursors and plasma gases.

The system's intuitive interface is designed to makes it easy to monitor and change recipes and processes.

"Our 500th ALD system shipment validates the increasing interest in ALD technology," said Ganesh Sundaram, vice president of Applied Technology, Veeco CNT. "Now, with the backing of Veeco, we will continue our legacy to build and enhance the deployment of ALD technology, helping customers like North Carolina State University develop next generation electronic devices."

Veeco CNT is a platinum sponsor of the 17th International Conference on Atomic Layer Deposition (ALD 2017) that takes place on July 15-18, 2017 in Denver, Colorado. Ultratech-CNT will be exhibiting as well as presenting a number of papers.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: