PHIX And Tyndall Institute Strengthen PIC Partnership
Knowledge sharing will ensure open access to high volume PIC packaging through PIXAPP Pilot Line
PHIX Photonics Assembly and PIXAPP Pilot Line coordinator Tyndall National Institute have strengthened their collaboration in the development of the photonic packaging ecosystem by facilitating dedicated training of PHIX engineers on Tyndall’s advanced packaging equipment.
This sharing of knowledge, they say, will strengthen the photonics ecosystem in Europe, ensuring open access to high volume Photonic Integrated Circuit (PIC) packaging through the PIXAPP Pilot Line.
PHIX offers its customers photonic assembly services targeting high volume PIC applications. The initiator and shareholder of PHIX (LioniX International) is also a partner in the PIXAPP Pilot Line, and will provide PIXAPP with access to a new high-volume assembly line as the next stage for customers after accessing the Pilot Line. Both PHIX and Tyndall will actively supply engineering resources to support the further development of packaging and assembly processes.
PHIX will provide state-of-the-art infrastructure in the Netherlands, supporting the European and worldwide industrial development of PICs. PHIX focuses on a hybrid platform, consisting of two or more different chips assembled in a planar configuration and coupled to optical fibres. The PICs are fabricated on InP or Silicon substrates. This hybrid platform supports a wide range of applications, and PHIX will standardise key process and assembly steps with the support of Tyndall.
“Offering packaging services requires both processing and state of the art equipment knowledge", says Albert Hasper, CEO of PHIX. "With Tyndall, we have found a partner that has a broad range of processing knowledge for PIC assemblies complementary to our expertise".
“We are delighted to support PHIX in the development of volume packaging processes and to provide comprehensive training to its staff". says Peter O’Brien, director of the PIXAPP Pilot Line at Tyndall. “A key objective of PIXAPP is to build the integrated photonics ecosystem, establishing a volume manufacturing capability in Europe. Our focus on packaging design rules helps achieve this objective, ensuring efficient and scalable assembly processes. We plan to train PHIX engineers on the principles of these design rules, and how to implement them to build complex integrated photonic assemblies."