Loading...
News Article

Disco introduces larger SiC ingot saw

News

New DAL7440 laser saw supports KABRA processing of 8-inch diameter wafers

To address the growing demand for SiC as a material to replace silicon in power devices. Disco developed its KABRA process (SiC ingot slicing method) a couple of years ago.

The KABRA (key amorphous-black repetitive absorption) process focuses a laser in the interior of a SiC ingot that, through repetitive passes decomposes SiC into amorphous silicon and amorphous carbon, and forms a layer that acts as the base point for wafer separation.

It exhibited its first DAL7420 laser saw for 6-inch diameter SiC wafers at SEMICON Japan 2016. Since then, it has been developing technology to handle bigger wafers and has now introduced the DAL7440 laser saw, which supports the KABRA processing of 8-inch diameter wafers.

The DAL7440 supports 8-inch diameter ingots with support for future increases to ingot diameter size. Maximum ingot thickness is 40 mm. Other features include alignment-free orientation, an ingot thickness measurement function, and the ability to track the total number of processed wafers

DAL7440 will be set up in DISCO's North Carolina office to handle processing test requests in the US.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: