VisIC Partners With TSMC On GaN-based Power Devices
Latest 1200V module is based on TSMC’s 650D GaN-on-Silicon process and VisIC's GaN transistor design
VisIC Technologies, a GaN power chip company, is now sampling the industry's first 1200V GaN modules, and is announcing a major manufacturing partnership with TSMC on its GaN on silicon technologies that were announced last year.
Engineering samples are now in design with lead customers,and trade demonstrations will take place during PCIM China 2018 Shanghai.
This extremely fast power switch module is said to perform with the highest efficiency in the industry, enabling small yet efficient xEV chargers and uninterruptible power supply (UPS) systems.
The new VisIC module is based on TSMC's 650D GaN-on-Silicon process and VisIC's GaN transistor design.
Switching time below 10 nanoseconds is ensured by a HEMT design, where electrons flow in a 2-dimentional quantum well, which fundamentally differs from electron flow in SiC MOSFETs.
With 1200 V ratings, the GaN module offers typical on resistance of just 40 mΩ. Target applications are power converters for motor drives, three-phase power supplies and other applications requiring current switching up to 50 A.
VisIC's 1200V GaN device is a half-bridge module that integrates GaN HEMTs with push-pull and over-current and over-temperature protections in a single package.
The design takes advantage of VisIC's Advanced Low Loss Switch (ALL-Switch) technology, which uses a patented, high-density lateral layout that results in fast switching performance and low RDS(on).
The high-voltage GaN module offers reduced gate charge and capacitances with low RDS(on), so the switching energy for the GaN device is as low as 140 µJ. Consequently, the switching losses are three to five times lower as compared to comparable SiC MOSFETs.
The GaN power device market is predicted to be over US$ 332,5 million in 2022 according to Yole Développement (Yole), the market research & strategy consulting company (Source: GaN Power Epitaxy, Devices, Applications and Technology Trends report, Yole Développement, November 2017), based on products rated for 650V of blocking voltage and below.
VisIC's new product opens access to a wider market of devices with 1200V blocking voltage, currently serviced by Silicon IGBT and SiC MOSFET devices.
“We are very pleased to partner with VisIC, an exciting new entrant to the fast-growing GaN power market,” said Maria Marced, president of TSMC EMEA .
“TSMC has made significant capital and engineering investment in our GaN manufacturing capability, which makes this platiorm well suited to support VisIC and its customers' demands. We look forward to working with VisIC as they drive adoption of this new platiorm.”
In addition to UPS and xEV chargers, 1200V GaN technology enables a wide range of inverter applications, which require high current, in the range of hundreds of Amperes. These high-current applications require a high volume GaN manufacturing capability, which TSMC provides.
“GaN has betier fundamental physical properties, such as maximal breakdown field and current density, than those of silicon or SiC. There are no fundamental limitations for GaN products to address the high voltage high current space” said VisIC CTO Gregory Bunin.
“This manufacturing partnership allows VisIC to ramp capacity very quickly. I am proud to partner with TSMC. They are outstanding, world-class supply-chain partners and I am confi- dent in their ability to support the dramatic growth expectations we have for our GaN power devices.”