Macom shows PIC-Enabled Solutions for CWDM4
Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure
At OFC 2018, March 13th-15th in San Diego, California, Macom has launched the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of its L-PIC (Laser-integrated Silicon Photonic Integrated Circuit) solution for 100Gbps CWDM4.
Central to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fibre.
The L-PIC platform provides an integrated silicon photonic solution targeting specific data centre applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers.
Using the company's patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.
The new MAOT-025402 is designed to mate with the MASC-37053A CDR to form the complete high speed transmit path for QSFP28 CWDM4 solutions.
Macom is leveraging our L-PIC platforms to enable leading scalability that meets the rapidly increasing CWDM4 module demand," said Vivek Rajgarhia, senior VP and general manager, Lightwave, at Macom.
"The platform's automated self-aligning calibration and firmware control is anticipated to deliver the requisite combination of scale and cost for mainstream Cloud Data centre deployment."
