Transphorm Launches Gen IV GaN Platform
Latest generation of high voltage GaN Power FETs bring better performance at lower cost
Transphorm has announced availability of its Gen IV GaN platform, which the company says offers notable advancements in performance, designability, and cost when compared to its previous GaN generations. Transphorm has also announced that Gen IV and future platform generations will be called SuperGaN technologies.
The first JEDEC-qualified SuperGaN device will be the TP65H300G4LSG, a 240 mΩ 650 V GaN FET in a PQFN88 package. The second SuperGaN device is the TP65H035G4WS, a 35 mΩ 650 V GaN FET in a TO-247 package. These devices are currently sampling and will be available Q2 and Q3 respectively.
Target applications include adapters, servers, telecommunications, broad industrial, and renewables. System designers can assess the technology in Transphorm’s 4 kW bridgeless totem pole AC-DC evaluation board, the TDTTP4000W066C-KIT.
SuperGaN Gen IV benefits include a flatter and higher efficiency curve with an improved Figure of Merit (RON*QOSS) of approximately 10 percent. The new generation also offers more simplicity of design-in by removing the need for a switching node snubber at high operation currents. Gen IV removes the switching current limits for the built-in freewheeling diode function in half bridges too.
Transporm says that Gen IV’s 35 mΩ FET offers the same gate robustness of +/- 20 Vmax and noise immunity of 4 V that is currently delivered by Transphorm’s Gen III devices.
“We expect Transphorm’s SuperGaN FETs to continue to impact next gen power electronics as the evolution of Silicon superjunction MOSFETs did,” said Transphorm's Philip Zuk. “Our Gen IV GaN platform is creating new design opportunities in other power stages through better performance while increasing customers’ overall ROI. Our ability to reduce losses and bring the initial device investment down closer to what customers are used to with Silicon without sacrificing reliability is another indicator that GaN’s position in the marketplace is strengthening.”
