Loading...
News Article

EPC and VPT launch Joint Space Venture

News

EPC Space will provide advanced, high-reliability, GaN power conversion components

Efficient Power Conversion (EPC) and VPT (part of HEICO), have established EPC Space LLC, a joint venture focused on designing and manufacturing radiation hardened (Rad Hard) GaN-on-silicon transistors and ICs packaged, tested, and qualified for satellite and high-reliability applications.

EPC Space will provide advanced, high-reliability, power conversion solutions for critical spaceborne environments in applications including power supplies, light detection and ranging (lidar), motor drive, and ion thrusters. These GaN-based components offer superior performance advantages over traditional silicon-based solutions.

Alex Lidow, CEO and co-founder of EPC said: “VPT’s global leadership in power conversion solutions for avionics, military, and space applications is the perfect complement to EPC’s leadership in GaN-based power conversion devices.” Further, Lidow said, “The joint venture – EPC Space – is taking the superior performance of gallium nitride to the high reliability community offering electrical and radiation performance beyond the capabilities of the ageing Rad Hard silicon MOSFET.”

Dan Sable, Founder and CEO of VPT commented, “EPC’s GaN technology enables a new generation of power converters in space operating at higher frequencies, higher efficiencies, and greater power densities than ever achievable before. We are excited about this venture’s ability to provide mission-critical components and services to our high-reliability markets.”

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: