Loading...
News Article

Macom Announces new Laser Portfolio

News

New range of more than 50 products addresses 5G and data centre applications

Macom Technology has announced the production release of its new high speed laser portfolio, after the successful completion of Telcordia GR-468 qualification testing.

All products in the portfolio incorporate a new single ridge design for enhanced optical performance and use Macom’s patented Etched Facet Technology (EFT) and wafer-scale InP manufacturing capabilities which can support high volume applications, including 5G wireless infrastructure and Cloud Data centre.

“We are pleased to achieve this milestone,” said Stephen G. Daly, president and CEO “Customer feedback on our new 25 and 50 gigabit laser performance has been positive and our focus will now turn to gaining market share.”

Macom is branding the new 25Gbps and 50Gbps distributed feedback (DFB) single ridge laser portfolio as Clear Diamond Lasers. The portfolio includes over fifty laser products with wavelengths between 1260nm and 1380nm to support multiple global 5G infrastructure applications, including 1310 BiDi, CWDM6, MWDM12, LWDM12, DWDM16 and 50Gbps PAM4. The portfolio also supports 200G FR4, 100G CWDM4 and LR4 applications for Data centre networks.

Macom’s Clear Diamond Lasers product portfolio offer customers world class performance, high reliability and supply chain security. The lasers’ standardized form factor supports ease of use and design flexibility enabling shorter optical transceiver design cycle time and faster time to market. The Clear Diamond Lasers product portfolio can be paired with Macom’s high speed analogue and mixed signal chipsets to achieve leading optical transceiver performance.

All Clear Diamond Lasers products are available as bare die or in TO-Can packages and are available to support G-Temp, I-Temp and E-Temp requirements.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: