Sivers to develop laser arrays for AI
Company signs product development agreement with undisclosed strategic partner
Sivers Semiconductors' subsidiary Sivers Photonics has signed a product development agreement with an undisclosed company.
Beginning with an initial contract valued at $1.3 million for delivering prototypes in 2024, the agreement is expected to grow rapidly during 2025, before moving to volume manufacturing. Upon entering full production, the annual chip volume is anticipated by the customer to exceed several million units per annum beyond 2026.
Sivers, a maker of advanced customised lasers for high-speed optical solutions, says it is well placed to capitalise on the rising demand for next-gen laser chips that enable solutions to voracious AI computing demands. The company’s optical communication technology already powers applications requiring high bandwidth and low latency data transmission. The new collaboration will further expand Sivers’ footprint into the rapidly evolving AI hardware sector.
"As optical solutions become essential for advanced AI workloads, our technology will help power the light-speed data transmission this new computing paradigm demands. This is a fantastic opportunity short term and is a mega opportunity for exceptional continued growth from 2026” said Anders Storm, Group CEO of Sivers Semiconductors.
