Game-changing 3D satcom module combines III-V and silicon
Circuits Integrated Hellas (CIH), an Athens-based satcoms technology company, has launched what is thought to be the first integrated solution to combines transmit, receive, and antenna functionality within a proprietary 3D antenna-in-package (AiP) and system-in-package (SiP) architecture.
By vertically stacking compound III-V semiconductors like GaAs and GaN with silicon technologies, the 3D module (called Kythrion) delivers over 60 percent reduction in antenna size, weight, power and cost (SWaP-C), while increasing thermal performance—without the need to overhaul existing manufacturing infrastructure.
Kythrion addresses the limitations of legacy flat panel phased array antennas, which often account for up to 20 percent of satellite payload mass and introduce design trade-offs in size, cost, and power. By eliminating unnecessary PCB layers and consolidating RF, logic, and antenna elements in a dense 3D chip, Kythrion enables Satcom operators to do more with less—fitting more advanced sensors on Earth observation platforms, including low Earth-orbit (LEO) satellites, extending mission lifetimes, and reducing launch costs.
“There is nothing else like Kythrion on the market today,” said Paolo Fioravanti, CIH co-founder and CEO. “It’s a true game-changer—engineered to improve FPA performance; to fundamentally reshape how satcom platforms are designed, deployed, and scaled; and to contribute to environmental change efforts by enabling better, more consistent capture and analysis of Earth observation data.”
Users of Earth observation platforms face shrinking data windows and urgent demand for real-time, high-throughput connectivity. With up to 20x bandwidth improvements and dramatic mass reduction, Kythrion enables satellite operators to integrate more sophisticated payloads—such as high-resolution sensors, multispectral imaging systems, or artificial intelligence (AI)-driven analytics—without requiring larger spacecraft or booster upgrades.
“Kythrion is not about reinventing the wheel—it’s about reengineering how we use it,” said Giannis Kontogiannopoulos, CIH co-founder and CTO. “From the materials we source to the missions we enable, we’re making it possible to scale Satcom capabilities sustainably, affordably, and globally. Kythrion positions CIH as a true enabler for next-gen satellite technology.”
CIH is making Kythrion available as a flexible platform that supports chip sales, design-for-license engagements, or custom integration. The platform is currently undergoing packaging and stress validation, with early-stage demonstrators expected in late Q3 2025 and general availability in Q2 2026. Patent protections are in place for Kythrion’s core design and packaging architecture, with additional filings in development to cover future enhancements.
CIH executives will be available to meet with attendees interested in learning more about Kythrion and its implications for the future of Satcom technology during Space Meetings Veneto, May 20-22, in Venice, Italy.
