Sivers and GF to develop AI data centre devices
Sivers Semiconductors has announced a strategic collaboration with GlobalFoundries (GF) in which Siver's laser arrays will be integrated into reference designs built on GF’s silicon photonics platform. The aim is to develop photonics solutions for the AI infrastructure market.
The collaboration supports a range of architectures including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data centre interconnect solutions. Sivers’ laser arrays will also be available in GF’s Silicon Photonics Co-packaged Advanced Light Engine (SCALE) platform for next-generation optical sub-assemblies and light engine architectures.
GF’s SCALE CPO solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and advanced packaging enablement to improve bandwidth density and system scalability.
“The rapid expansion of AI workloads and hyperscale data centre architectures demand advanced photonics technologies that deliver higher bandwidth, improved energy efficiency, and scalable optical connectivity,” said Raymond Biagan, CRO at Sivers Semiconductors. “Our collaboration with GlobalFoundries positions both companies at the leading edge of silicon photonics innovation.”
“GlobalFoundries continues to see strong momentum for silicon photonics solutions as AI data centre architectures evolve toward higher bandwidth density and improved power efficiency,” said Vikas Gupta, senior fellow, Silicon Photonics Product Line at GlobalFoundries. “Pairing Sivers Semiconductors’ laser array technology with our silicon photonics and SCALE CPO platforms provides our customers with advanced, scalable optical engine solutions for high-bandwidth co-packaged optics and optical interconnects.”
