Aixtron R&D-system to be centrepiece of Penn State lab
Aixtron's Close Coupled Showerhead (CCS) R&D epitaxial growth system will serve as the centrepiece of a new advanced semiconductor research facility at Penn State’s Materials Research Institute (MRI).
The laboratory, which will focus on next‑generation semiconductor thin films and device research, is being established through $4.3m in infrastructure funding and in‑kind support provided through the University’s membership in the Midwest Microelectronics Consortium (MMEC) – part of the US Department of Defense’s Microelectronics Commons initiative under the federal CHIPS Act.
Aixtron’s CCS deposition system is capable of depositing high‑quality semiconductor layers on substrates with diameters of up to 100 mm. The installed system is configured to grow both wide-bandgap GaN materials for high‑performance power electronics and 2D semiconductors with potential for emerging logic, optoelectronic, and neuromorphic computing applications. It can also be scaled to enable Penn State scientists to move from materials research to prototype device fabrication.
“We are proud to see our technology play a central role in advancing Penn State’s semiconductor R&D infrastructure. Combining wide-bandgap and 2D materials capabilities in a single deposition system creates a powerful platform for both academic research and the development of real‑world applications – from energy‑efficient power devices for electric vehicles to next‑generation AI hardware,” said Felix Grawert, CEO of Aixtron SE.
“The facility will serve as a national user platform, offering hands‑on training for students and early‑career researchers while providing industry‑standard process know‑how,” said Joan Redwing, distinguished professor of materials science and engineering and of electrical engineering and director of the University's 2D Crystal Consortium research facility.
Redwing added, “We look forward to the collaboration between Penn State and Aixtron in fostering a skilled workforce and supporting cutting‑edge semiconductor device research. This initiative is a model for how academia and industry can work together to strengthen the US innovation ecosystem and supply chain.”
