Pfeiffer introduces UltiDry vacuum pumps
Pfeiffer Vacuum+Fab Solutions, a member of the Busch Group, has launched the UltiDry multi-stage roots vacuum pumps.
Designed for demanding semiconductor applications, the new pumps are engineered to withstand corrosive gases, aggressive by-products, and heavy powder loads. Their oil-free, multi-stage compression ensures clean, dry vacuum generation without contamination, making them suitable for processes such as CVD, ALD, and PVD.
One of the key innovations in the UltiDry is a patented purge injection system, developed to protect the vacuum pump by flushing out contaminants like powder. This feature ensures stable performance and smooth operation, even in powder-intensive processes, according to the company.
Energy consumption is a major cost factor in semiconductor fabs. With its optimised multi-stage roots design, the UltiDry is said to energy savings of up to 87 percent compared to other vacuum pumps in its class.
The vacuum pump operates reliably across a thermal range from 50 °C to 270 °C, adapting flexibly to different process requirements. This makes it equally suitable for temperature-sensitive coating processes as well as corrosive semiconductor applications.
