EMCORE Releases New 15 Gbps Parallel Optical Interconnect for Commercial Applications

High Speed Tranceivers For Very Short Reach Datacom and Telecom Networks

SOMERSET, N.J. EMCORE Corporation (NASDAQ: EMKR), a leading provider of semiconductor technologies for global communications, has announced the commercial production of its new high speed, cost-effective parallel optical array transmitter/receiver modules to accommodate the soaring demand for network capacity.

This technology exemplifies the new age of optical interconnects for switches and routers for datacom and telecom equipment manufacturers. The new transmitter/receiver modules, which provide a data rate of 1.25 Gbps over 12 channels, are the initial offering in a new family of products from EMCORE designed to provide customers with the speed, performance and reliability required to drive their data throughput.

Designed for use in parallel optical data communications links, the modules offer an aggregate bandwidth of 15 Gbps and can be used in high-speed data links, very short reach OC-192 optical links, and board-to-board and shelf-to-shelf high-speed interconnects for optical backplanes. The modules perform logic-to-light and light-to-logic conversions for data transmission over multimode fiber ribbon cable, at a wavelength of 850nm and a power consumption of typically just 2 watts for the pair.

According to Dr. Robert Bryan, Vice President of EMCORE s Fiber Optics division, ``In providing the market with a replacement for expensive serial interconnects, we have endeavored to ensure maximum manufacturing flexibility for our datacom and telecom customers. The use of a ball grid array (BGA) in EMCORE s new offering will ensure significantly easier manufacturing for customers. Each module connects to external electrical circuitry using a compact BGA pattern on its underside, and therefore is one of the first optics that does not require special handling for insertion onto circuit boards. One of the many applications for these optics is to construct VSR transponders, which offer datacom and telecom equipment manufacturers significant cost and functionality advantages.

EMCORE has developed a VSR transponder that is pluggable and compliant with the industry-wide 300 pin multi-source agreement and with the Optical Internetworking Forum s Implementation Agreements for SERDES-framer interface (SFI-4) and VSR OC-192 interfaces. The transponder is anticipated to be available in September, 2001.

Reuben F. Richards, Jr., President and CEO of EMCORE noted, ``EMCORE continues to focus on providing innovative, manufacturer-friendly solutions to the broadband communications market. This new transceiver offers the technology to provide our customers with higher backplane bandwidth for faster switching. Providing more Gbps per dollar , our initial product enables customers to better compete in today s highly challenging marketplace.

According to ElectroniCast Corporation, the extremely rapid growth in networking has been fueling the growth of aggregation switches, very high speed routers, high capacity DWDM transmission equipment, larger digital cross connects, and now optical cross connects for optical networking. ``Communications between these classes of intra-office equipment is based on SONET, and links between them operate from OC-3 to OC-48, according to Stephen Montgomery, President of ElectroniCast. ``As routers grow to terabit scale, and cross connects and transport systems manage OC-192 traffic, these systems need to be interconnected at 10 Gbps to minimize the large number of interconnections, Mr. Montgomery said.

EMCORE Corporation offers a versatile portfolio of compound semiconductor products for the rapidly expanding broadband and wireless communications and solid state lighting markets. The Company s integrated solutions philosophy embodies state of the art technology, material science expertise and a shared vision of our customer s goals and objectives to be leaders and pioneers in the rapidly growing world of compound semiconductors. EMCORE s solutions include: optical components for high speed data and telecommunications; solar cells for global satellite communications; electronic materials for high bandwidth communications systems, such as Internet access and wireless telephones; MOCVD tools for the growth of GaAs, AlGaAs, InP, InGaP, InGaAlP, InGaAsP, GaN, InGaN, AlGaN, and SiC epitaxial materials used in numerous applications, including data and telecommunications modules, cellular telephones, solar cells and high brightness LEDs. For further information about EMCORE, visit http://www.emcore.com.

The information provided herein may include forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934 relating to future events that involve risks and uncertainties. Words such as ``expects, ``anticipates, ``intends, ``plans, believes,`` and estimates,`` and variations of these words and similar expressions, identify these forward looking statements. Actual operating results may differ materially from such forward-looking statements and are subject to certain risks, including risks arising from: cancellations, rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification cycles; difficulties in the production process; changes in semiconductor industry growth, increased competition, delays in developing and commercializing new products, and other factors described in EMCORE s filings with the Securities and Exchange Commission. The forward-looking statements contained in this news release are made as of the date hereof and EMCORE does not assume any obligation to update the reasons why actual results could differ materially from those projected in the forward-looking statements.

Contact:

EMCORE Corporation, Somerset
Tom Miehe, 732/271-9090
Fax: 732/271-9686
Email: info@emcore.com
or
Richartz Fliss Clark & Pope, Denville
Glen Turvey, 973/627-8180
Fax: 973/627-8410
Email: turvey@rfcp.com