TriQuint and Amkor collaborate on CuFlip process
TriQuint has already introduced the CuFlip process in its ultra-small 6x6mm TQM 7M4009 GSM power amplifier module. The high-density interconnect capability of CuFlip has enabled a 40% size reduction in this GSM PA and improved RF performance compared to its predecessor. The direct thermal connection to the surface of the substrate provided by CuFlip bumps is especially valuable in PA design. It enables smaller die sizes and improved long-term reliability due to lowered die operating temperatures.
"Amkor has been an excellent partner in the development of our CuFlip assembly process. Their extensive expertise in flip-chip assembly and process development has helped us meet our performance and scheduled requirements," said Ron Ruebusch, VP of operations at TriQuint Oregon.
Ruebusch added that CuFlip-based assembly is another important milestone in TriQuint s long-term strategy of integrating the RF front-end for mobile phones utilizing the company s broad technology portfolio of power amplifiers, PHEMT switches, integrated passives and SAW filter components.
"Amkor provides us with high-volume production capacity to ramp-up CuFlip based products quickly," he said. "Amkor s proven ability to achieve capacity and quality benchmarks will be another plus for the customer."
The CuFlip process is compatible with standard laminate substrate materials. Semiconductors manufactured for CuFlip assembly require substantially less processing compared to products intended for wire-bond assembly, resulting in lower cost due to higher-yield, faster cycle time, reduced work-in-progress, and lowered capital equipment expenses. The repeatability of a CuFlip-based module is increased compared to an equivalent wire-bond module due to better control of the interconnect process resulting in improved RF performance.
