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Multiplex offers epitaxy, device foundry services

Multiplex, a manufacturer of fiber-optic components and subsystems, is trying to find a use for its extensive epitaxial growth and device manufacturing capabilities by offering custom compound semiconductor foundry services.
The company operates a 10,000 square foot cleanroom facility (class 1000 and 10,000) in South Plainfield, NJ, which contains complete front-end capabilities for III-V semiconductor epitaxial growth, processing device design, testing, reliability qualification and failure mode analysis. Multiplex is ISO 9001-2000 certified for all phases of these capabilities.

The company has a number of Aixtron multi-wafer MOCVD machines for the growth of GaAs- and InP-based materials, and claims that its technical staff have over 200 man-years of collective experience in MOCVD epitaxy.

Multiplex plans to offer epitaxial growth services for:
* 980, 1310 and 1550 nm laser platforms (FP, DFB etc) and other custom structures and wavelengths
* pin and APD wafers optimized for 2.5 and 10 Gbit/s receiver applications
* custom photosensor and imaging wafers and chips for 1.2 to 1.65 micron applications

Multiplex will also offer foundry services for materials characterization, processing services and device design, testing, and qualification.

As a vertically integrated manufacturer, Multiplex says that it possesses the in-house capabilities to handle these complex operations, and to provide a high degree of customization to meet specific and stringent customer requirements.

“With some of the industry’s most talented experts in these areas, and the facilities to more than adequately handle these complex processes, this was a logical step for Multiplex,” said Won Tsang, Multiplex’s president and CEO.

“We have had a successful run of high-end finished products, and I am confident that opening up our facilities to the industry will prove to be equally successful.”

Multiplex currently manufactures a range of active components and transponders, including 10 Gbit/s pin and APD photoreceivers; 10 Gbit/s high-speed EMLs; high-power 980 nm pump lasers; 10 Gbit/s tunable EML transmitters; and a full product suite of 10 Gbit/s 300-pin transponders.

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