Dow Corning Expands Epitaxy Capability
Mark Loboda, Science and Technology Manager, Dow Corning Compound Semiconductor Solutions, said, “After a rigorous review, we selected the AIXTRON system to enable us to deliver the morphology, defect density and uniformity required by our customers. The added capacity and capability up to 150mm will allow us to meet our customer s rapidly growing needs for high power SiC device production."
Dr. Frank Wischmeyer, Vice President and Managing Director, AIXTRON AB, Sweden, added: “Building on over 10 years of experience with our SiC Hot-Wall Planetary Reactor technology, we are able to offer the proven next generation SiC AIX 2800G4 WW epitaxial production system. The enhanced productivity of the system is due to design features such as a central water cooled triple gas injector, improved process robustness and simplified maintenance procedures. Based on AIXTRON’s proven IC design, the AIX 2800G4 WW system shares a common platform with over 300 installed systems worldwide. AIXTRON is pleased to partner with Dow Corning Compound Semiconductor Solutions as they advance SiC devices into high volume low cost manufacturing."
The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.
Join us face-to-face between 28th – 29th June 2022
- View the agenda.
- 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
- Email info@csinternational.net or call +44 (0)24 7671 8970 for more details.
*90% of exhibition space has gone - book your booth before it’s too late!
