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How Has The Compound Semiconductor Industry Reduced Costs?

The EMC3D semiconductor equipment and materials consortium has extended its agreement in order to improve the industry further.
Improvements in the compound semiconductor industry have been vital in reducing costs, it has been claimed.

From an original closing date of October 2009, the members of the international EMC3D semiconductor equipment and materials consortium have now extended their agreement to July 2011.

Originally, the aims of the group were to commercialise individual unit processes that could be implemented easily into a volume production environment and to enable a low overall cost of ownership (CoO) for 3D chip stacking.

Initial CoO targets were of $200 (£122) per wafer, but EMC3D project director Paul Siblerud noted that now fabs running iTSV can produce 3D-TSV devices at less than $150 per unit.

He commented: "Improved synchronization between the unit processes along with aggressive cost saving designs have been very successful at exceeding the consortium s original cost goals."

Equipment efficiency, reduced material expenses and simplified process flow have all been vital in lowering costs, Mr Siblerud concluded.

The group EMC3D was originally established in September 2006.ADNFCR-2855-ID-19428892-ADNFCR
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