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Semiconductor Heat Stability 'furthered' By University Researchers

Semiconductor heat resistance abilities could be furthered after a team of university scientists have made a breakthrough with particle stability.
Semiconductor miniaturisation could further advance after a team of researchers at the University of Pittsburgh have demonstrated high-temperature stability in metallic nanoparticles.

The instability of particles at this scale has so far proved a hindrance for applications such as sensors, Gotz Veser, from Pitt s Swanson School of Engineering, said. In order for the extent of nanoparticles to be realised, their heat sensitivity needs to decrease so processes can be made more efficient.

Metal-alloy particles - forged from the semiconductors rhodium and platinum - in the range of four nanometres were developed by the researchers and were able to withstand temperatures of more than 850 degrees Celsius.

The development could prove important for the progression of semiconductor efficiency as materials less than five nanometres have a higher surface area and more particles are used, increasing efficiency.

"For us to reap the benefits of nanoparticles, they must withstand the harsh conditions of actual use," stated Mr Veser.

Metal oxide semiconductors can be used in sensors to improve camera technology which requires compact design, such as endoscopy, SPIE - an international society advancing light-based research - recently reported.ADNFCR-2855-ID-19488584-ADNFCR
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