ANADIGICS Unveils Industry's Smallest Dual-Band CDMA Power Amplifier for Latest-Generation Mobile Handsets
ANADIGICS, Inc. today announced the latest version of its highly successful dual-band CDMA power amplifiers (PAs) – the AWC6323 - designed for today’s most advanced CDMA handsets and data cards for the world’s leading wireless providers. For the first time, high performance directional couplers have been integrated into a dual band CDMA PA in the 3 X 5 X 1 (mm) footprint. The product also offers the lowest quiescent current for a CDMA PA in the industry which helps extend the battery life. The innovations built into the AWC6323 enable the latest generation handsets to provide an improved consumer experience.
The AWC6323 is the flagship PA in ANADIGICS’ portfolio of High-Efficiency-at-Low-Power (HELP(TM)) family of CDMA PAs. The device is now ramping into volume production and complete evaluation kits are available upon request.
“The AWC6323 has received tremendous response from our customers.
Customers are particularly enthusiastic about the high levels of integration in a very small package. The innovations inherent to the AWC6323 help simplify design, reduce component count and save on board space. These attributes directly address the needs of today’s advanced handsets and datacards,” said Prasanth Perugupalli, Director of the Wireless RF Product Line at ANADIGICS. “ANADIGICS is also offering extensive support for our customers through a front-end reference design kit, utilizing the most commonly used filters and prescribed matching networks to aid in the phone board design and reduce time-to-market.”
Key facts and highlights:
* The AWC6323 Offers 3 mode states to achieve high power added
efficiencies at several power levels during the phone operation.
* It also helps reduce the idle current of the power amplifier to
industry-best 3.5mA for a CDMA power amplifier. This directly helps
in increasing the talk time performance of the handset without the
need for a DC-DC converter.
* The AWC6323 PA features a common output port for the directional
couplers built inside the package. These couplers offer 20dB
directivity and 22dB coupling factor. This feature helps eliminate
the surface mount couplers placed on the phone board.
* The device also meets the stringent linearity requirements of CDMA
EV-DO Revisions A and B modulations, to offer very high data rates
for smart phones and data cards.
* The AWC6323 is manufactured on advanced indium gallium phosphide
(InGaP) BiFET(TM) MMIC technology, offering the highest levels of
reliability, temperature stability and ruggedness.
Additional product features include:
* Internal voltage regulation
* Common Vmode control line
* Simplified Vcc bus PCB routing
* Reduced external component count
* A low-profile surface mount package (1 mm)
* RoHS compliance (260 degrees Celsius MSL-3)
The AWC6323 will be on display at Mobile World Congress, Feb. 15-18 in Barcelona, Spain. For more information, visit the ANADIGICS booth located at Stand 2C19 in Hall 2 or visit www.anadigics.com.
