+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

RFMD Products Enable First Ever Full 3D Smartphone by LG

The firm’s PowerSmart and WiFi design has secured wins in multiple devices including LG’s world's first full 3D smartphone, the Optimus 3D.

RFMD’s PowerSmart power platforms and WiFi front end modules have been selected by LG to enable a broad portfolio of next-generation 3G/4G smartphones, including the LG Optimus 3D. This is the world's first full 3D smartphone. The LG Optimus 3D was unveiled on Monday at Mobile World Congress 2011 in Barcelona.

Bob Bruggeworth, president and CEO of RFMD, said, "RFMD is pleased to support LG's popular Optimus product family, and we're proud our PowerSmart power platforms and WiFi components are featured in such an innovative device as the Optimus 3D. We believe our PowerSmart power platforms lead a product category that is reshaping the future of multimode, multi-band cellular RF architectures, and we look forward to further leveraging our product and technology leadership across LG's growing 3G/4G product portfolio."

PowerSmart power platforms feature an RF Configurable Power Core that delivers multiband, multi-mode coverage of all cellular communications modulation schemes, including 2G, 3G and 4G, up to LTE 64QAM. The PowerSmart power platforms also include all necessary switching and signal conditioning functionality in a compact reference design, providing smartphone manufacturers a single scalable source for the entire cellular front end.

RFMD's PowerSmart power platforms are now in production in support of multiple families of flagship 3G/4G smartphones and tablet devices, supporting the Company's expectations that PowerSmart power platforms satisfy its customers' most stringent RF performance requirements.

RFMD's RF3482 WiFi front end module satisfies smartphone and tablet manufacturers' requirements for aggressive size reductions in 802.11b/g/n front end solutions, while delivering high linear output power and greatly reducing the number of components outside the core connectivity chipset.
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: