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Multiple Plasma Systems Being Installed At Chinese University

The systems, from Oxford Instruments, will be used for nanoscale science and engineering. They will be used for advanced RIE SiNx and SiO2 etching and deposition and silicon etching
Oxford Instruments is currently installing several PlasmaPro plasma etch and deposition tools at the Nanotechnology Centre at the University of Science and Technology of China (USTC) to facilitate their fundamental research in micro- and nano-scale technology.

USTC’s nanofabrication facility based in Hefei, An’hui Province-East China, strives to drive collaborative, interdisciplinary, and fundamental research in the micro- and nano-scale.

Zhu Xuelin comments, “USTC has a very strong background in the fields of nanoscale science and engineering. The Nanotechnology Centre recently ordered a PlasmaPro100 ICP380 system for silicon etching, a PlasmaPro80 RIE advanced etching tool for SiO2 and SiNx etching, in addition to a PlasmaPro100 PECVD system for SiO2 and SiNx deposition from Oxford Instruments."

PlasmaPro tool

He adds, "These systems will be used to replicate and form various nanostructures on wafers, which is highly critical in several nanoscale science fields including quantum physics, quantum information, nano-materials and nano-chemistry. We chose Oxford Instruments tools as they could provide the multiple leading edge technologies, excellent process flexibility and capabilities, backed by the effective customer support offering that USTC expects."

“As a leading plasma etch and deposition tool manufacturer, one of our key advantages is that we offer a wide range of R&D process and system solutions, making us the ideal provider to research institutes worldwide," says David Haynes, Sales and Marketing Director at Oxford Instruments, “At USTC researchers are pushing the limits in nanoscience, nanoengineering, and nanotechnology to create novel materials, structures, and devices, and we are delighted that our systems are facilitating this excellent work."

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