The gallium nitride SPICE chips are incorporated in NI's Multisim 13.0 software, which is designed to improve power system efficiency and reduce final product size and development time

Efficient Power Conversion Corporation (EPC) says its enhancement mode GaN transistors (eGaN FETs) SPICE models have been included in the latest version of National Instruments’ Multisim circuit simulation and design software.

The Multisim toolkit enables engineers to easily calculate, change and sweep critical component parameters in advanced power conversion system applications.

“The EPC component models in Multisim 13.0 are now leveraged by thousands of engineers to improve power system efficiency, reduce final product size, reduce development cost, or a combination of all three," says Mahmoud Wahby, product manager at National Instruments.

"Multisim is also a leading circuit design tool in both academia and with companies that are excited about basing their power electronics designs on cutting edge components. We are delighted to have EPC’s industry-leading GaN transistors included in Multisim and are looking forward to the future releases of eGaN FETs and their continued integration within Multisim," he continues.

According to Alex Lidow, EPC’s co-founder and CEO, “In order to make eGaN FETs easy to use, we developed these devices to behave very much like silicon power MOSFETs, but with greatly enhanced high frequency capability. With the inclusion of our products in Multisim SPICE models, National Instruments provides user-friendly tools that make a significant impact in how easy it is to design with our eGaN devices. These device models will enable rapid time-to-market of power conversion systems taking full advantage of our high performance GaN power transistors."

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

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