News Article
TriQuint combines GaAs and silicon to accelerate global mobile growth
The versatile, highly integrated modules prolong battery life with new envelope tracking technology. They also simplify complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners
Mobile devices have changed our lives enormously. Nowadays, most of us have a smartphone or tablet and use it more like a computer.
This phenomenon is driving a rapid increase in data traffic, which is expected to grow more than ten-fold over the next five years as smartphone adoption continues.
TriQuint says its three new highly integrated multi-mode, multi-band power amplifier modules (MMPAs) will deliver longer battery life for LTE smartphones and mobile devices while simplifying increasingly complex RF design.
The firm's MMPAs use both silicon and GaAs technology. The combination of the technologies is more efficient in terms of design and infrastructure than its current silicon competitor, silicon CMOS.
While silicon CMOS is gaining traction at the lower end of the market in 2G and lower 3G mobile devices, the technology does not provide adequate support across all radio frequency bands.
These versatile new products - which are already capturing design wins in leading LTE smartphones have the following qualities:
Support envelope tracking for higher power efficiency, MIPI interface for design flexibility
Include more bands to cover more regions
Build on DWs w/ leading smartphone manufacturers
Simplify complex RF design for multi-band smartphones
Provide smaller size, simplified PCB routing, reduced BOM count and faster time to market
“Building on the success of TriQuint’s highly integrated TRIUM MMPAs, our three newest products add more LTE bands to cover more regional markets, as well as support for power-saving envelope tracking and a versatile new MIPI interface,” explains Sean Riley, Vice President of Mobile Products.
Device manufacturers are adopting envelope tracking (ET) in next-generation smartphones to maximise energy efficiency. ET extends battery life by dynamically adjusting the supply voltage to the power amplifier (PA), in contrast to PAs with conventional constant-supply voltage.
TriQuint’s new MMPAs also feature a new mobile chip interface - based on an open “MIPI” standard - used by several chipset providers to increase interoperability among vendors and reduce development time and effort.
In addition to designing ever more sophisticated devices, smartphone manufacturers serving the global market must produce several regional variants of each model to operate in carriers’ specific assigned spectrum.
This is becoming more challenging as numerous new LTE bands are allocated. The versatile design of TriQuint‘s new MMPAs gives manufacturers a common platform to release new products at a faster pace, while controlling design and manufacturing costs.
They support a growing number of popular 3G/4G bands for specific regions as well as quad-band GSM/EDGE. By integrating more functionality into smaller form factors, they simplify PCB routing, reduce BOM count and speed time to market.
This phenomenon is driving a rapid increase in data traffic, which is expected to grow more than ten-fold over the next five years as smartphone adoption continues.
TriQuint says its three new highly integrated multi-mode, multi-band power amplifier modules (MMPAs) will deliver longer battery life for LTE smartphones and mobile devices while simplifying increasingly complex RF design.
The firm's MMPAs use both silicon and GaAs technology. The combination of the technologies is more efficient in terms of design and infrastructure than its current silicon competitor, silicon CMOS.
While silicon CMOS is gaining traction at the lower end of the market in 2G and lower 3G mobile devices, the technology does not provide adequate support across all radio frequency bands.
These versatile new products - which are already capturing design wins in leading LTE smartphones have the following qualities:
Support envelope tracking for higher power efficiency, MIPI interface for design flexibility
Include more bands to cover more regions
Build on DWs w/ leading smartphone manufacturers
Simplify complex RF design for multi-band smartphones
Provide smaller size, simplified PCB routing, reduced BOM count and faster time to market
“Building on the success of TriQuint’s highly integrated TRIUM MMPAs, our three newest products add more LTE bands to cover more regional markets, as well as support for power-saving envelope tracking and a versatile new MIPI interface,” explains Sean Riley, Vice President of Mobile Products.
Device manufacturers are adopting envelope tracking (ET) in next-generation smartphones to maximise energy efficiency. ET extends battery life by dynamically adjusting the supply voltage to the power amplifier (PA), in contrast to PAs with conventional constant-supply voltage.
TriQuint’s new MMPAs also feature a new mobile chip interface - based on an open “MIPI” standard - used by several chipset providers to increase interoperability among vendors and reduce development time and effort.
In addition to designing ever more sophisticated devices, smartphone manufacturers serving the global market must produce several regional variants of each model to operate in carriers’ specific assigned spectrum.
This is becoming more challenging as numerous new LTE bands are allocated. The versatile design of TriQuint‘s new MMPAs gives manufacturers a common platform to release new products at a faster pace, while controlling design and manufacturing costs.
They support a growing number of popular 3G/4G bands for specific regions as well as quad-band GSM/EDGE. By integrating more functionality into smaller form factors, they simplify PCB routing, reduce BOM count and speed time to market.
