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Nujira: Envelope Tracking - Transforming The Performance Of CMOS And GaAs PAs

Presentation at CS International conference
Envelope Tracking technology is being rapidly adopted by the smartphone industry to boost the energy efficiency of RF Power Amplifiers in 4G smartphones. 

In addition to boosting energy efficiency, ET fundamentally changes the operating mode of the PA, enabling designers to push device performance beyond traditional boundaries. 

The presentation will introduce the basics of ET technology, explain how it impacts both CMOS and GaAs PA designs, and how it has the potential to transform the RF front-end landscape for 3G, 4G and WiFi standards.

CS International 2014 - 18th, 19th March, 2014, Frankfurt, Germany

To gain a comprehensive overview of the entire compound semiconductor industry, the must attend event for 2014 is the 4th CS International conference in Frankfurt, Germany.

Delegates will get the unique opportunity to network with leading industry professionals of the III-V chip making industry, interact with suppliers and industry experts who will deliver the latest research, business models, and insights aligned to their job roles. 

During the two days, delegates will have the unique opportunity to listen to six key themes and 36 inspiring presentations. Hear about the breakthroughs in device technology; insights into the current status and the evolution of compound semiconductor devices; and details of advances in tools and processes which could help boost fab yields and throughputs. 

CS International is established as the industry’s leading international conference attracting delegates and sponsors from the global compound semiconductor industry. 

Last few delegate places left, book today!

http://www.cs-international.net/register.php


AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

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