News Article

Compound Semiconductor Conference Hits A New High

35 presentations equipped delegates with a comprehensive overview of the compound semiconductor industry

Around 300 delegates and over 30 sponsors descended on Frankfurt for the fourth CS International Conference, which was held at the Sheraton Airport Hotel this week.

This must-attend event for the leaders of the compound semiconductor industry set a new standard for its number of presentations.

The conference covered all aspects of the industry, with presentations grouped into six key themes:

Power Electronics


Integration of CMOS and III-Vs

Wide Bandgap RF Devices

Front-ends for Mobile Devices

Lasers, PICs & PV

Presentations on these topics highlighted the growing penetration of compound semiconductors into the silicon industry, and the use of silicon in the making of III-V chips. Leading developers of next-generation CMOS, such as IBM and Imec, are pioneering approaches to integrate high-mobility materials, for example InGaAs, into the channels of transistors in microprocessors, while silicon substrates are viewed as a low-cost platform for making LEDs, as well also power and RF electronics based on GaN.

Meanwhile, power amplifiers that are based on silicon are starting to go head-to-head with those made from GaAs for deployment in the latest smartphones. It appears that devices based on CMOS will gain market share, but GaAs will dominate the market for many years to come.

A more detailed report of the presentations at CS International Conference will appear in the April /May edition of Compound Semiconductor magazine. This issue will also contain details of the winners of the coveted CS Industry Awards.

For more information about CS International Conference, and opportunities available for the 2015 event, contact Stephen Whitehurst: Tel 0044 (0)2476 718 970.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



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