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IPG Announces Configurable Fibre Laser Workstation

The firm's UV laser systems are suited for fabricating complex 2-D and 3-D structures such as micron-scale devices. Heat-free laser ablation facilitates exact tolerances without collateral damage to the material
IPG Photonics Corporation has introduced the IX-200-F, an advanced fibre laser micromachining system for general purpose, R&D and batch-scale production applications.

The multi-functional system can easily be configured with different combinations of fibre lasers and beam delivery systems to address high-precision, cutting, drilling and patterning micromachining applications. It represents the optimum combination of IPG's fibre laser and materials micro-processing workstation technologies.

IPG's IX-200-F is a fully enclosed and interlocked CDRH Class 1 system, configurable with a wide range of IPG fibre lasers and fully integrated with the system operating hardware and software. The system core consists of special structural design granite to minimise the effects of vibration and thermal drift on the overall accuracy of the product.

The IX-200-F features a high-resolution, high-performance microscope vision system which provides a continuous zoom range from 38X to 880X for sub-micron automated part alignment and inspection. System software includes macro-building tools for fast programming and generation of automated processes for complex feature machining. Additional utilities allow complex pattern input from standard CSV and DXF files.

The selection of IPG Fibre lasers currently supported on the IX-200-F includes pulsed IR to over 500 watts and pulsed green up to 50 watts as well as UV lasers. Users may select ablation or thermal cutting and scanning or fixed beam delivery configurations.

The IX-200-F includes precision, multi-axis part-handling and vision systems for accurate machined feature placement and process control and fully-integrated software enabling both ease of use and highly complex machining functions.



Top (L-R): FR-4, ITO ; Bottom (L-R): Al2O3, Copper

Applications for IPG's IX-200-F include cutting of ceramics, metals, polymers and semiconductor materials and patterning of ITO and other thin-films. Drilling applications include hole diameters down to 15 microns in 300 micron thick ceramics, with placement accuracies of better than

5 microns, at rates of 100 holes per second. The advanced world class applications laboratories of IPG Microsystems located in Manchester, NH USA, provide demonstrations and proof of concept application studies for domestic and international customers.

"The IX-200-F combines IPG's world-leading fibre lasers and the industry-proven IX-200 precision workstation design into a flexible product that provides users a highly cost-effective laser processing tool," states Jeffrey Sercel, President of IPG Microsystems.

"The range of configurable options that can be either factory installed or field installed at a later date, enables users to purchase the capability they need today and preserve the value of the capital investment through future upgrades as application requirements evolve."



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