News Article
European consortium to deepen photonic device knowledge
A Pan-European research team intends to demystify nano, photonic and electronic codes
Scientists at Tyndall National Institute, Cork, Ireland, are leading a European research project which will develop a test environment to help create the photonic and electronic devices of the future.
Led by Eoin P. O’Reilly, Head of Theory, Modelling and Design Centre, Tyndall National Institute, DEEPEN will involve Tyndall-based researchers working in close partnership with research teams from across Europe.
These are ETH Zurich (Switzerland), Osram Opto Semiconductors (Germany), Paul-Drude-Institut für Festkörperelektronik (Germany), Synopsys (Switzerland) and Tiberlab S.r.l. (Italy). The project will use the combined expertise in device design and nanomaterials of its members, to help revolutionise the design and implementation of future photonic and electronic devices.
DEEPEN project team (Left to Right): Mathieu Luisier (ETH Zurich), Lutz Geelhaar (Paul Drude Institute Berlin), Eoin O'Reilly (Tyndall), Alvaro Gomez-Iglesias (Osram Opto Semiconductors), Fabio Sacconi (TiberLab) and Axel Erlebach (Synopsys)
Entitled ‘DEEPEN’ (from Atomic to Device Explicit simulation Environment for Photonic and Electronic Nanostructures), the three-year, EU-funded project is being formally launched this week in Athens, Greece at the Industrial Technologies 2014 Conference.
The conference integrates nanotechnology, biotechnology, advanced materials and new production technologies, and offers opportunities for developing valuable research and industry collaborations by showcasing cutting-edge research, latest innovations and rising companies from all around Europe.
DEEPEN is a direct response to industry’s need to track and analyse performance at the atomic scale of a design process. To address this issue, researchers are looking to develop an efficient and robust framework that allows different computer codes to be merged.
Using this open-source framework, the integrated simulation tools will enable developers to track a device’s overall performance changes at a particularly detailed and precise level during testing.
Speaking at the Industrial Technologies 2014 Conference, O’Reilly said, “The DEEPEN project gives us an opportunity to work with leading academic and industry partners in this challenging but highly rewarding area. Our work will have a direct impact on future device design and optimisation. In addition, our development of open source codes will help to open up this field to the wider research community”.
DEEPEN is part of a cluster of five, FP7-funded projects being launched today at the Multiscale Modelling workshop in Athens. The Cluster is intended to enable knowledge exchange, to foster adoption of novel approaches for multi-scale modelling.
With a network of two hundred industry partners and customers worldwide, Tyndall generates around €30 million income each year, 85 percent from competitively won contracts nationally and internationally.
Tyndall is also a lead partner in European research partnerships in its core areas of ICT, communications, energy, health and the environment worth €44 million, including €6 million accruing to industry in Ireland (from Framework 7).
Hosting what it says is the only full CMOS (metal oxide semiconductor) integrated circuit construction, Micro Electronic Mechanical systems (MEMS) and III-V Wafer Semiconductor fabrication facilities and services in Ireland, Tyndall is prototyping new product opportunities for its target industries - electronics, medical devices, energy and communication.
Led by Eoin P. O’Reilly, Head of Theory, Modelling and Design Centre, Tyndall National Institute, DEEPEN will involve Tyndall-based researchers working in close partnership with research teams from across Europe.
These are ETH Zurich (Switzerland), Osram Opto Semiconductors (Germany), Paul-Drude-Institut für Festkörperelektronik (Germany), Synopsys (Switzerland) and Tiberlab S.r.l. (Italy). The project will use the combined expertise in device design and nanomaterials of its members, to help revolutionise the design and implementation of future photonic and electronic devices.
DEEPEN project team (Left to Right): Mathieu Luisier (ETH Zurich), Lutz Geelhaar (Paul Drude Institute Berlin), Eoin O'Reilly (Tyndall), Alvaro Gomez-Iglesias (Osram Opto Semiconductors), Fabio Sacconi (TiberLab) and Axel Erlebach (Synopsys)
Entitled ‘DEEPEN’ (from Atomic to Device Explicit simulation Environment for Photonic and Electronic Nanostructures), the three-year, EU-funded project is being formally launched this week in Athens, Greece at the Industrial Technologies 2014 Conference.
The conference integrates nanotechnology, biotechnology, advanced materials and new production technologies, and offers opportunities for developing valuable research and industry collaborations by showcasing cutting-edge research, latest innovations and rising companies from all around Europe.
DEEPEN is a direct response to industry’s need to track and analyse performance at the atomic scale of a design process. To address this issue, researchers are looking to develop an efficient and robust framework that allows different computer codes to be merged.
Using this open-source framework, the integrated simulation tools will enable developers to track a device’s overall performance changes at a particularly detailed and precise level during testing.
Speaking at the Industrial Technologies 2014 Conference, O’Reilly said, “The DEEPEN project gives us an opportunity to work with leading academic and industry partners in this challenging but highly rewarding area. Our work will have a direct impact on future device design and optimisation. In addition, our development of open source codes will help to open up this field to the wider research community”.
DEEPEN is part of a cluster of five, FP7-funded projects being launched today at the Multiscale Modelling workshop in Athens. The Cluster is intended to enable knowledge exchange, to foster adoption of novel approaches for multi-scale modelling.
With a network of two hundred industry partners and customers worldwide, Tyndall generates around €30 million income each year, 85 percent from competitively won contracts nationally and internationally.
Tyndall is also a lead partner in European research partnerships in its core areas of ICT, communications, energy, health and the environment worth €44 million, including €6 million accruing to industry in Ireland (from Framework 7).
Hosting what it says is the only full CMOS (metal oxide semiconductor) integrated circuit construction, Micro Electronic Mechanical systems (MEMS) and III-V Wafer Semiconductor fabrication facilities and services in Ireland, Tyndall is prototyping new product opportunities for its target industries - electronics, medical devices, energy and communication.
