News Article

European Consortium To Deepen Photonic Device Knowledge

A Pan-European research team intends to demystify nano, photonic and electronic codes
Scientists at Tyndall National Institute, Cork, Ireland, are leading a European research project which will develop a test environment to help create the photonic and electronic devices of the future.

Led by Eoin P. O’Reilly, Head of Theory, Modelling and Design Centre, Tyndall National Institute, DEEPEN will involve Tyndall-based researchers working in close partnership with research teams from across Europe.

These are ETH Zurich (Switzerland), Osram Opto Semiconductors (Germany), Paul-Drude-Institut für Festkörperelektronik (Germany), Synopsys (Switzerland) and Tiberlab S.r.l. (Italy). The project will use the combined expertise in device design and nanomaterials of its members, to help revolutionise the design and implementation of future photonic and electronic devices.

DEEPEN project team (Left to Right): Mathieu Luisier (ETH Zurich), Lutz Geelhaar (Paul Drude Institute Berlin), Eoin O'Reilly (Tyndall), Alvaro Gomez-Iglesias (Osram Opto Semiconductors), Fabio Sacconi (TiberLab) and Axel Erlebach (Synopsys)

Entitled ‘DEEPEN’ (from Atomic to Device Explicit simulation Environment for Photonic and Electronic Nanostructures), the three-year, EU-funded project is being formally launched this week in Athens, Greece at the Industrial Technologies 2014 Conference.

The conference integrates nanotechnology, biotechnology, advanced materials and new production technologies, and offers opportunities for developing valuable research and industry collaborations by showcasing cutting-edge research, latest innovations and rising companies from all around Europe.

DEEPEN is a direct response to industry’s need to track and analyse performance at the atomic scale of a design process. To address this issue, researchers are looking to develop an efficient and robust framework that allows different computer codes to be merged.

Using this open-source framework, the integrated simulation tools will enable developers to track a device’s overall performance changes at a particularly detailed and precise level during testing. 

Speaking at the Industrial Technologies 2014 Conference, O’Reilly said, “The DEEPEN project gives us an opportunity to work with leading academic and industry partners in this challenging but highly rewarding area. Our work will have a direct impact on future device design and optimisation. In addition, our development of open source codes will help to open up this field to the wider research community".

DEEPEN is part of a cluster of five, FP7-funded projects being launched today at the Multiscale Modelling workshop in Athens. The Cluster is intended to enable knowledge exchange, to foster adoption of novel approaches for multi-scale modelling.

With a network of two hundred industry partners and customers worldwide, Tyndall generates around €30 million income each year, 85 percent from competitively won contracts nationally and internationally.

Tyndall is also a lead partner in European research partnerships in its core areas of ICT, communications, energy, health and the environment worth €44 million, including €6 million accruing to industry in Ireland (from Framework 7).

Hosting what it says is the only full CMOS (metal oxide semiconductor) integrated circuit construction, Micro Electronic Mechanical systems (MEMS) and III-V Wafer Semiconductor fabrication facilities and services in Ireland, Tyndall is prototyping new product opportunities for its target industries - electronics, medical devices, energy and communication.


AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event