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Brewer Science announce Apogee temporary wafer bonder

New bonder completes Brewer Science tool suite for low-volume production or R&D lab environments
Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, has unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

The Apogee bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices.

Brewer Science says this collection of tools provides reduced time to market for ultrathin wafer technologies using integrated material and process solutions.

The Brewer Science Apogee features include:

Substrate size range of 50-300 mm
Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
Ultraflat self-leveling platens minimize total thickness variation (TTV)
Evacuated bond chamber eliminates voids
Carrier and device are separated during pre-bond evacuation
Total thickness variation:
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