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News Article

Northrop Grumman sampling tiny InP ultra LNAs

The indium phosphide devices are designed for commercial and military use
Northrop Grumman has developed two high performance Monolithic Microwave Integrated Circuit (MMIC) broadband ultra-low-noise amplifiers (LNA) that are in production for immediate delivery.

The InP high electron mobility transistor (HEMT) LNAs are for use in E-band and W-band commercial, civil and military applications such as communication links, sensors, millimetre-wave imaging, radars and digital microwave radios.

The compact die design of each LNA considerably reduces footprint size and exhibits very good ultra-low-noise performance and high gain.

"The LNAs are the initial release of products designed with the company's InP process, a powerful semiconductor technology that has successfully been used in Northrop Grumman's advanced military communication systems," says Frank Kropschot, general manager, Microelectronics Products and Services at Northrop Grumman. "For the first time, Northrop is offering products for similarly demanding commercial applications."

Product descriptions

ALP283:

The ALP283 is a W-band 1.7 mm2 InP HEMT low-noise amplifier that operates between 80 and 100 GHz. This power amplifier provides 29 dB of linear gain, 2.5 dB typical Noise Figure and 1dB gain compression power (P1dB) of 3 dBm (2 mw). It has a 2 dB typical average noise figure from 80 - 100 GHz. It is ideally suitable for W-Band millimetre-wave imaging applications, sensors and communication links.



ALP275:

The ALP275 is W-band 2.125 mm2 InP HEMT ultra-low-noise amplifier that operates between 71 and 96 GHz. This power amplifier provides greater than 26 dB of linear gain, 3 dB typical Noise Figure and P1dB of 4 dBm (2.5 mw). It is suited to E-Band and W-Band communications links.

To ensure rugged and reliable operation, both LNAs are fully passivated. Both bond pad and backside metallisation are Ti/Au, which is compatible with conventional die attach, thermocompression and thermosonic wire bonding assembly techniques.

 

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