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Mitsubishi launches wafer bonding services

Machines can bond different kind of materials at room temperature

Mitsubishi Heavy Industries (MHI) has launched wafer bonding services performed using its in-house developed wafer bonding machines, which are capable of bonding different kind of materials at room temperature.

Until now the company has offered trial services of this kind to businesses and other potential users considering the machine's adoption; now those same services have been expanded to include businesses and research institutes with no immediate plans to acquire the machine.

In launching the new services, MHI aims to boost recognition of the effectiveness of room-temperature wafer bonding, a technology originating in Japan, as a means toward expanding machine sales; it also looks to develop bonding services into a new area of business.

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