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Plessey Expands Into Chip Scale And Wafer Level LED Packaging

Application Specific LED can provide 'mass customisation' to solid state lighting market

Earlier this week, Plessey announced its expansion into chip scale and wafer level packaging leading to its Application Specific LED (the AS-LED). The company will have its first chip scale package solution available for sampling later this quarter.

Keith Strickland, Plessey CTO, said: "Our most recent advancements in performance to greater than 50 percent wall plug efficiency coupled with our unique semiconductor technologies and manufacturing capabilities have pushed us to our next stage of technology development."

He added: "We need to move the conversation from lumens/watt to how the semiconductor industry can provide the capability for mass customisation needed for the solid state lighting industry."

Strickland says that his company's LED components are more than competitive with any sapphire or SiC solution, but the industry needs far more. He believes the AS-LED provides the solution to the mass customisation needed in the solid state lighting markets.



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