Plessey Expands Into Chip Scale And Wafer Level LED Packaging
Application Specific LED can provide 'mass customisation' to solid state lighting market
Earlier this week, Plessey announced its expansion into chip scale and wafer level packaging leading to its Application Specific LED (the AS-LED). The company will have its first chip scale package solution available for sampling later this quarter.
Keith Strickland, Plessey CTO, said: "Our most recent advancements in performance to greater than 50 percent wall plug efficiency coupled with our unique semiconductor technologies and manufacturing capabilities have pushed us to our next stage of technology development."
He added: "We need to move the conversation from lumens/watt to how the semiconductor industry can provide the capability for mass customisation needed for the solid state lighting industry."
Strickland says that his company's LED components are more than competitive with any sapphire or SiC solution, but the industry needs far more. He believes the AS-LED provides the solution to the mass customisation needed in the solid state lighting markets.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
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Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
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