+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

TOWA expands European Packaging Development Centre


The TOWA Corporation of Japan is investing an additional €1 million in the TOWA Europe Packaging Development Centre (PDC) to provide more floor space and extra equipment. 

TOWA Europe PDC, which was set up in Duiven in the Netherlands last February, moulds advanced semiconductor packages, LED lenses, and lenses for solar panels, and other advanced applications including new singulation solutions for LED devices. 

It has also become a leader in development of 3D packages, wafer level and large panel moulding and lenses for LEDs and automotive electronics.

×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: