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Logitech to demonstrate how to optimise processing of III/V materials

Demos will show how lapping and polishing systems can remove process variability
Logitech has announced that it will be demonstrating its lapping and polishing systems at the Compound Semiconductor International Exhibition and Conference in Frankfurt, 11th "“12th March 2015. 
Logitech will be showing how its systems can help optimise the processing of III/V materials, such as removing process variability, increasing accuracy and material removal rates. 
The Compound Semiconductor Exhibition and Conference is a two day global event that will give a comprehensive view of the compound semiconductor industry with over 30 presentations discussing the market evolution, new device technology and details of advances in tools and processes. 

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