Chip scale  white LEDs target the general illumination market

Lumileds has extended its chip scale packaged (CSP) LED range with the addition of the Luxeon FlipChip White. CSP technology eliminates the traditional submount to minimise package size, enabling manufacturers to directly attach the LED die to the PCB, which can cut system costs.

The company first introduced Luxeon FlipChip Royal Blue in February 2013. In early 2015, Lumileds released the Luxeon FlipChip UV, and has now introduced Luxeon FlipChip White for the general illumination market. 

High lumen applications such as outdoor and industrial lighting will benefit from the high drive current capabilities and robust high power architecture of Luxeon FlipChip White, according to the company. In addition, the small source size and high lumen density of Luxeon FlipChip White enables high packing density and superior beam control for directional lamps and luminaires. 

Luxeon FlipChip White is offered in two package sizes (1.4 x 1.4 mm and 1.1 x 1.1 mm) and a range of CCTs across 70 and 80 CRI. Lumileds also offers Luxeon FlipChip White on its market-leading Matrix Platform. These LED boards, linear flex and modules can come configured with Luxeon FlipChip White along with connectors, optics, wiring and/or electronics, improving time-to-market and simplifying the supply chain.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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