Loading...
News Article

Lumileds expands Luxeon Flipchip Line

Chip scale  white LEDs target the general illumination market

Lumileds has extended its chip scale packaged (CSP) LED range with the addition of the Luxeon FlipChip White. CSP technology eliminates the traditional submount to minimise package size, enabling manufacturers to directly attach the LED die to the PCB, which can cut system costs.

The company first introduced Luxeon FlipChip Royal Blue in February 2013. In early 2015, Lumileds released the Luxeon FlipChip UV, and has now introduced Luxeon FlipChip White for the general illumination market. 

High lumen applications such as outdoor and industrial lighting will benefit from the high drive current capabilities and robust high power architecture of Luxeon FlipChip White, according to the company. In addition, the small source size and high lumen density of Luxeon FlipChip White enables high packing density and superior beam control for directional lamps and luminaires. 

Luxeon FlipChip White is offered in two package sizes (1.4 x 1.4 mm and 1.1 x 1.1 mm) and a range of CCTs across 70 and 80 CRI. Lumileds also offers Luxeon FlipChip White on its market-leading Matrix Platform. These LED boards, linear flex and modules can come configured with Luxeon FlipChip White along with connectors, optics, wiring and/or electronics, improving time-to-market and simplifying the supply chain.

 

New efficiency record for CIGS perovskite tandem cells
Realising tuneable InGaN laser diodes
SiC patenting strong in Q4 2024, says KnowMade
Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
Multiple materials vie for RF success
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: