Loading...
News Article

Hanoi Telecoms Selects Infinera packet-optical platform

TM-series to be used in metro network connecting Ho Chi Minh City and Vung Tau

Infinera, a maker of InP photonic integrated circuits (PICs) and related network equipment, has announced that Hanoi Telecom Corporation's (HTC) has chosen the company's TM-Series packet-optical platform, via its local partner Nissho Electronics Vietnam, for HTC's metro network in Vietnam connecting Ho Chi Minh City and Vung Tau.

HTC is a wireless telecom operator in Vietnam offering carrier and wholesale services, focusing primarily on providing wireless, wireline Internet and VoIP services. The company offers its mobile services under Vietnamobile to more than 13 million wireless subscribers.

This is the first selection of Infinera's TM-Series by an existing Infinera customer post the acquisition of Transmode, which closed on August 20, 2015. The Infinera TM-Series packet-optical platform provides multi-service capabilities including services such as Ethernet/CE2.0, MPLS-TP and OTN aggregation, which are well suited for mobile fronthaul and backhaul, and metro aggregation applications.

Infinera worked closely with partner Nissho Electronics Vietnam, an end-to-end network system integrator, to select the carrier-class solutions enabling HTC to rapidly respond to its customers' needs.

Through Infinera's partnership with Nissho Electronics Vietnam, HTC first deployed the Infinera DTN and ATN platforms in its network. The Infinera TM-Series solves HTC's new requirement for an optimised 10G transport solution upgradeable to 100G, including 1+1 protection, high density, low power and space savings.

"We are pleased to continue to deploy Infinera's wide range of application specific solutions to help us meet our needs," said Trinh Minh Chau, chairwoman & CEO at Hanoi Telecom. "The Infinera TM-Series will support our metro applications where high density, low power and bandwidth scalability are critical for providing innovative services to our end customers."

"HTC's deployment of the Infinera TM-Series underscores the significance of Infinera's expansion into the metro market and marks our first customer announcement highlighting the combined Infinera and former Transmode solutions," said Andrew Bond-Webster, Infinera's vice president sales, Asia.

"This announcement also emphasises the value of our channel partners and is a great example of the company's ability to provide customers with packet-optical transport solutions across all layers of the network and for specific applications."

New efficiency record for CIGS perovskite tandem cells
Realising tuneable InGaN laser diodes
SiC patenting strong in Q4 2024, says KnowMade
Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: