Qorvo Combines GaN on SiC With Advanced Packaging
Qorvo, a provider of technologies and RF solutions for mobile, infrastructure and aerospace/defence applications, has announced a series of innovations intended to accelerate the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design. Qorvo's newest multi-chip module packaging, thermal sensing pins, and GaN on SiC integration capabilities enable CATV product designers to lower costs, increase bandwidth, and reduce board space.
Qorvo's multi-chip-module (MCM) packaging helps customers reduce board space by up to 50 percent, according to the company, and enables up to 30 percent cost savings versus traditional SOT115J packaging. Qorvo's MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its newest MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.
Qorvo says that companies can use GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, Qorvo's GaN on SiC technology helps reduce overall power consumption by up to 20 percent with associated features such as adjustable current control.
Kellie Chong, director, CATV and Broadband Access products for Qorvo, said: "Qorvo is leveraging our broad portfolio of advanced packaging and process technologies to help leading CATV customers lower costs, increase bandwidth, and achieve significant board space savings. Qorvo has shipped more than two million CATV GaN amplifiers and is the industry-leading GaN supplier for the cable market. We are pleased to offer customers the benefits of our newest innovations to accelerate the deployment of their DOCSIS 3.1 networks."
Qorvo's newest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in 9mm x 8mm MCM packaging.
