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Seoul's package-less LED gains traction

Wafer level LED gains fast adoption in indoor and outdoor lighting

Wicop2 module for indoor (left), outdoor (centre), flood lights (right) 

Seoul Semiconductor has announced that following successful use in LCD backlighting applications, its Wicop LED packaging is being fast adopted in lighting systems.

Wicop is a wafer-level form of packaging in which the chip is bonded directly to the PCB with IC and other components. Compared to the widely used 3030 LED package (3x3mm), the latest version Wicop2 , which Seoul announced last month, takes up a quarter of the area with twice the brightness. 

Wicop2 also has over 30 percent less thermal resistance compared to conventional LEDs due to the removal of previously essential lead frames and substrates, according to the company. A 12W LED lighting application may need eight 3030 LED packages, whereas for the same performance Wicop2 uses 50 percent (four Wicop2 packages) less the area.

First System, a Japanese lighting company, has designed its outdoor LED lighting fixtures around WICOP2, and is planning to release the product line immediately. Chinese LED module manufacturer LITI also integrated Wicop2 into the mass-production of five different flood light LED modules for high luminous efficiency and reliability.

Wicop2 is being evaluated at indoor lighting company TCP and will also be designed into the wall washer products of European company Fiberli. Over 50 companies in Europe and the US have now confirmed the use of Wicop2 and are looking to release prototypes within the year.

Andrew Kim, head of Lighting Sales at Seoul Semiconductor, said: "Numerous counterfeit products have been in the market since Wicop's release in 2012, but none has gained any commercialisation traction due to poor quality," He also adds: "Seoul Semiconductor is tracking a few competitors for potential IP infringement and legal actions."

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