Veeco wins multiple packaging system orders
Veeco Instruments has announced that is has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm System.
The system was developed by Solid State Equipment Corporation (SSEC), a company acquired by Veeco a year ago and renamed Veeco Precision Surface Processing or PSP. SSEC specialised in single wafer wet etch, clean and surface preparation equipment targeting high growth segments in advanced packaging, micro-electro-mechanical systems (MEMS) and compound semiconductor.
The WaferStorm platform provides wafer processing solutions for advanced packaging applications."¨"¨ According to Veeco, the flux cleaning technology will process wafers for Fan-out Wafer Level Packaging (FO-WLP) production. Fluxing is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities to ensure a clean metallic interface for the next assembly step. As bump pitches become finer, removing flux residues has become more challenging."¨"¨In its latest report, TechSearch International projects FO-WLP unit volume to grow at a compound rate of 87 percent over the next five years. According to TechSearch, FO-WLP is an attractive solution that allows companies to continue taking advantage of the powerful economics of die shrink, while also meeting the small form factor, low-profile package requirements of mobile devices."¨"¨
"As the complexity of the packaging process increases, our differentiated technology enables customers to more tightly control the flux removal process resulting in higher yields," said Herman Itzkowitz, senior VP and general manager of Veeco PSP.
Veeco's process equipment solutions enable the manufacture of LEDs, displays, power electronics, compound semiconductors, hard disk drives, semiconductors, MEMS and wireless chips. The company focuses on MOCVD, MBE, Ion Beam, Wet Etch single wafer processing and other advanced thin film process technologies.
