News Article
Four reasons you will kick yourself if you miss CS International 2016
CS International 2016 - 1,2 March 2016, Brussels, Belgium
We simply can't believe that the CS International conference has come around so quickly. Months of planning and preparation has come down to the less than 2 weeks of finishing touches to the conference programme and ironing out the small details with our exhibitors.
CS International 2016 will provide timely, comprehensive coverage of every important sector within the compound semiconductor industry.
Here are 4 reasons not to miss CS International
"Delegates attending CS International are guaranteed comprehensive, timely coverage of the most important issues facing our industry. The 2016 conference will build on the great and growing success of its five predecessors, with a tremendous line-up of speakers, organised into five sessions." says Richard Stevenson, Editor of Compound Semiconductor magazine.
"As well as many great presentations to look forward to, from the likes of Qorvo, Peregrine, Skyworks, IBM, Lux Research and Finisar, there will be many companies to talk to at the exhibition," says Stevenson. "Those conversations could be very valuable, as they could offer insights into significant improvements in chip manufacturing."
During the two-day conference delegates will hear 34 talks that have been split into five themes. Each of these themes includes a keynote presentation, plus an overview of the sector by a leading market analyst (the full agenda can be viewed here).
Countries represented:
Austria, Belgium, Canada, China, Finland, France, Germany, Italy, Japan, Lithuania, Netherlands, Poland, Russia, Slovakia, Sweden, Switzerland, United Kingdom and United States.
Companies attending:
Aixtron, Akoustis, Akzonobel, Anadigics, Analog Device (ADI), Anvil Semiconductors, Azelis Electronics, AZUR SPACE Solar Power GmbH, BMW, Brolis Semiconductors, CEA LETI, Cmk Ltd Slovakia, CS Clean Systems, Dock, EAG, Enkris Semiconductor, Entegris Gmbh, EpiGaN, EU Project SPEED, EV Group (EVG), Evans Analytical Group (EAG), Evatec, Evatec Europe, Exagan, FBH Berlin, Ferrotec Corporation, Ferrotec Temescal Division, Finisar Germany Gmbh, Fraunhofer Institute For Applied Solid State Physics Iaf, Fraunhofer ISE, Freiberger Compound Materials GmbH , GEO Semiconductor (UK), GMX, Htt High Tech Trade Gmbh, Huawei Uk R Centre, IBM, Ihp Gmbh, III/V-Reclaim, IMEC, Indium Corporation, Innovate UK, Inspectrology LLC, Instytut Technologii Elektronowej, IQE, Jsc Sp Pulsar, Keysight Technologies, KITEC GmbH, k-Space Associates, Inc., Lasertec, LayTec, LUX Research, Macom Technology Solutions, Materion, Mersen, Meyer Burger Germany Ag, Mitsubishi Electric Europe, Nanometrics Inc, NAsP III/V GmbH, Norstel AB, Nrnu Mephi, Nuflare Technology America Inc, Okmetic, Oxford Instruments, Panasonic, Peer Group Gmbh, Pegasus Chemicals, Peregrine Semiconductor, Picosun Oy, Plasma, Power Integration Inc, Precision Fabricators Ltd, Qmat Inc, Qorvo, Rockwood Wafer Reclaim, RWTH Aachen, Scotech Ltd, SEMI Europe, Seren Photonics, Siltectra Gmbh, Siltronic, Skyworks, Soitec, Solaerotech, Sony Europe, ST Microelectronics, Strategy Analytics, Sumika Electronic Materials Inc, Sumitomo Electric Device Innovatins, Inc., Technical, University of Madrid, Temescal/Ferrotec, Thickness Measurement, Translucent, Transphorm, Two Deutschland Gmbh, Ulvac, Umicore, United Monolithic Semiconductors Gmbh, Universitat Marburg, Vactec, Veeco, Vishay Semiconductor GmbH, Vistec Electron Beam Gmbh, W Cobb Company, Yole Développement
Only 2 weeks to book your place. If you have not already booked your place, we are down to the last few places left, so book today.
